“ANALISIS PENGENDALIAN DEFECT CHIPPING DIE DI MESIN DIE ATTACH PADA PT EPSON BATAM”, comasiejournal, vol. 7, no. 5, hlm. 11–20, Des 2022, Diakses: Okt 06, 2026. Tersedia pada: https://ejournal.upbatam.ac.id/index.php/comasiejournal/article/view/6189